Wafer Equipment
SWAM C-5100 Wafer Coring, Contouring System | LV-1 or XV-1 Sand Blaster
SWAM C-5100 Wafer Coring, Contouring System | Work Area with Covers Open
C5100 Wafer Coring Edge Beveling System
Crystal Mark‘s SWAM® C-5100 replaces all grinding operations with one numerical, computer-controlled, micro-abrasive nozzle positioning system. The micro-abrasive blasting resizes the wafers without creating excessive heating. Also, there is a minimal effect from shock to the wafer. It is designed for Cutting and Edge Rounding of silicon, silicon carbide, sapphire, Geranium, NaG, GaAs, and other III-V materials, as well as for Epi Crown Removal.
Advantages of Crystal Mark Technology
- Precise work with guaranteed flat and/or notch in equivalent positions. This helps in keeping the alignment of silicon grains.
- Smooth edges that help in preserving the wafers. Sharp edges from other methods can cause wafers to crack.
- No crowning of wafer edges limits the effectiveness of wafer lines.
- Protection from electrostatic discharge preserves the circuits/components built in the silicon of the wafers.
- Achieve dimensional tolerances up to +/- .002″.
- Complete automation and control that simplifies the wafer assembly lines.
Surface Finishing
C129 Belt Abrading System | LV-1 /XV-1 SWAM Blasters | Variable Speed Conveyor Belt, Variable Speed Cam Driven Reciprocator Mechanism
C129 Belt Abrader System | Open Hood
C149 Belt Abrading System
C129 Automated Belt Abrading System
The SWAM® Abrading System by Crystal Mark finishes the surfaces consistently with the required precision.
Advantages of Micro Abrasive Blasting
- Remove oxides and junctions.
- Eliminate the backside damage for gettering, mesa diode processing, as well as for back lapping.
- Reliable cleaning.
This technology can also be used for surface finishing, surface texturing, and surface preparation for a variety of different applications.